General Epoxies

For Electronic Potting Applications

Newest epoxy materials for potting semiconductor components and electronic assemblies.

EPOXY – 125
Room temperature curing epoxy – for applications to 125°C.

EPOXY – 175
Elevated temperature curing epoxy – for applications to 175°C.

EPOXY – 200
Novalac-epoxy formulation – for applications to 200°C.

Epoxy – 225
Resin-Anhydride epoxy system – for high temperature applications to 225°C.

Description:

General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xyline polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.

Applications

General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.

PROPERTIES OF GENERAL PURPOSE EPOXIES

Physical Properties Epoxy –125 Epoxy –175 Epoxy –200 Epoxy –225
Color Black Black Black Black
Heat Dist.temp. (oC) 125 175 200 225
Visc. Mixed (cps) 2,200 38,000 20,000 4,200
Flex. Str. (psi) 13,600 15,600 14,500 14,000
Flex.Mod.x 10-5(psi) 4.08 3.37 3.90 4.4
Comp.Yield Str. (psi) 15,000 15,820 35,000 18,500
Comp.Mod x 10-5(psi) 3.40 3.10 2.60 2.89
Tensile Str. (psi) 11,300 10,500 10,000 10,000
Tens.Mod x 10-5(psi) ¾ ¾ 4.3 4.4
Izod Imp. Str.(ft.lbs./in.notch) 0.3 0.33 0.50 0.48
Hardness, Shore D 85 90 90 90
Shrinkage (max.) 1% 1% 1% 1%
Thermal Expan.(in/in/oC)x 10-6 30 30 30 30
Electrical Properties
Dielectric Constant
Frequency, cps 60 4.10 4.18 3.93 3.09
Frequency, cps 103 3.99 4.12 3.88 3.07
Frequency, cps 106 3.39 3.57 3.47 2.91
Dissipation Factor
Frequency, cps 60 0.0099 0.005 0.0067 0.0035
Frequency, cps 103 0.023 0.015 0.015 0.0054
Frequency, cps 106 0.034 0.039 0.029 0.015
Volume Resist. 1.19 x 1016 1.2 x 1016 1.2 x 1016 5.8 1016
Surface Resist. 7.9 x 1015 7.8 x 1015 7.9 x 1015 7.9 x 1015
Dielect. Str. V/mil 420 455 585 390
Arc Resit. (Av.Sec.) ¾ ¾ 120 75
Cure Schedule
Resin:hardner Ratio 100:17 100:12 100:10 100:45
Pot Life 1 hr. 4 hrs. 4 hrs. >24Hrs.
Initial Gel 4 hrs @ RT 2 hrs @ 90oC. 2 hrs @ 80oC. 2 hrs @ 90oC.
Post-Cure +48 hrs @ RT +4 hrs @ 150oC. +2 hrs @ 150oC. +4 hrs @ 165oC
+16hrs@ 200oC