GALLIUM ARSENIDE ETCHANTS

DESCRIPTION:

Gallium arsenide etchants offer isotropic or anisotropic etching of gallium arsenide and ternary compounds such as gallium indium arsenide and aluminum gallium arsenide. Clean, uniform etching is available in combination with silicon dioxide masks.

Two etching systems are offered. GA Etch 100 is an acidic, isotropic etchant with fast etch rate. GA Etch 300 provides greater versatility, broad photoresist compatibility, and an extended shelf life. All GA Etches require cold storage conditions.

PROPERTIES OF TRANSENE GA ETCH 100

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH <2
Etch Rate at 25°C 22 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 4 months
Storage Conditions Ambient, refrigeration preferred
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water; may be followed by alcohol rinse if desired.
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Ni, Au, Si, SiO2, alumina

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Cu, Al
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information

PROPERTIES OF TRANSENE GA ETCH 300

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH 6-7
Etch Rate at 40°C 32 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 6 months
Storage Conditions Ambient, refrigeration preferred
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water; may be followed by alcohol rinse if desired.
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Ni, Au, silica, alumina, silicon nitride

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Cu, Al
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information

APPLICATION:

GA Etches may be used in Pyrex, HDPE, Teflon, or other tank materials. Surface smoothness may be controlled by varying the agitation rate. GA Etch 100 is based on sulfuric acid/hydrogen peroxide chemistry. GA Etch 300 utilizes a mildly acidic citric acid-hydrogen peroxide formulation to achieve greater versatility.

Transene’s proprietary stabilizer package allows for consistent etch results over a longer time frame than typically available from peroxide chemistries.

All GA Etches are manufactured using high purity raw materials such as semi or ACS Reagent chemicals and 1018 Mohm.cm resistivity deionized water.