HEXAMETHYLDISILAZANE- HMDS

PHOTORESIST ADHESION WITH HEXAMETHYLDISILAZANE
Purified hexamethyldisilazane (HMDS) preparations promoting photoresist adhesion on silicon and other substrates.

HMDS – X10
10% HMDS solution in xylene

HMDS – X20
20% HMDS solution in xylene

HMDS – 100%
HMDS concentrate

FEATURES

  • Ready-to-use preparations for surface treatment of silicon
  • Promotes photoresist adhesion on silicon and SiO2 films
  • Prevents lift-off at edges of photoresist and reduces undercutting
  • Ensures full-line resolution
  • Improves yields of MOS and integrated silicon devices

HMDS- Photoresist Adhesion with Hexamethyldisilazane

DESCRIPTION:

HMDS is a purified hexamethyldisilazane with the chemical formula [(CH3)2Si]2NH. The product is used to augment the adhesion of photoresist on silicon and SiO2 surfaces.

The effectiveness of HMDS on adhesion is correlated with the reactivity of this compound with surface hydroxyl groups to form a new siloxane end product, i.e. Si-O-Si(CH3)3. This newly formed termination on the substrate renders the surface more hydrophobic in character and leads to greater wettability by photoresist. The latter condition is a crucial factor in good bonding. As a result of these altered characteristics due to the surface chemistry, the treated silicon surfaces become highly compatible with both negative and positive photoresists.

HMDS is offered in usable concentrations diluted with xylene as HMDS-X10 and HMDS-X20. Special blends are supplied upon request.

PROPERTIES OF HMDS (ACTIVE INGREDIENT)

PHYSICAL
Appearance Clear, colorless liquid
Density 0.77 g/cc
Index of Refraction 1.4
Molecular Weight 161.4
Boiling Point 126-127 °C
Flash Point 12.7 °C
CHEMICAL
Typical Purity 99+%
Sodium < 1 ppm
Iron < 1 ppm
Lead < 1 ppm
Copper < 1 ppm

APPLICATION:

HMDS preparations are generally applied to the silicon wafer while spinning, prior to the application of photoresist. As an alternative procedure, the wafers may be immersed in HMDS preparations and allowed to dry after removal.