Kapton Polymide Film Etchant

AN ETCHING REAGENT FORMULATED FOR POLYIMIDE/COPPER LAMINATES, COMPATIBLE WITH PHOTORESIST PROCESSES – RISTON, EASTMAN KODAK, AND DYNACHEM.

ETCH RATE
40 °C 0.013 MILS/MINUTE
60 °C 0.07 MILS/MINUTE
RINSE WATER
STORAGE ROOM TEMPERATURE
DISPOSAL DISPOSE OF ACCORDING TO LOCAL, STATE, AND FEDERAL REGULATIONS.