Moly Etchant – TFM
Tungsten Etchant – TFW

Selective etchants for moly and tungsten thin-film metallizations used in semiconductor and microelectronics technology. TFM and TFW are safe, selective etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns, with minimal undercutting and negative photoresist compatibility. Controlled uniform etching is achieved by immersion or spray etch technique. Alternatively, Moly Etchant 679 is a positive-resist-compatible blend of phosphoric-acetic-nitric acid with slower etch properties.

PROPERTIES OF TRANSENE MOLY ETCHANT TFM

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Brown
pH 10
Etch Rate at 30°C
80°C
55 Å/sec.
85 Å/sec
Etch Capacity (rate declines at ~70%) 30 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations PKP Type II or HARE SQ (SU-8 type)
Select Compatible Materials Au, Ni, Cu, alumina

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Si, Si-O
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong acids
Additional Information

PROPERTIES OF TRANSENE TUNGSTEN ETCHANT TFW

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Brown
pH 8
Etch Rate at 20°C 30 Å/second (immersion)

80 Å/second (spray)

Etch Capacity (rate declines at ~70%) 64 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations PKP Type II or HARE SQ (SU-8 type)
Select Compatible Materials Au, Ni, Cu, alumina

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Si, Si-O
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong acids
Additional Information