POSITIVE RESIST REMOVERS

PRR-001 and PRR-002
5-4 & 592
RESIST STRIP 586

PRR-001

DESCRIPTION:

Positive Resist Remover PRR-001 is composed of a proprietary mixture of water miscible and biodegradable ingredients. PRR-001 is formulated to remove (dissolve) all the common positive working photoresists baked onto various substrates (ex: gallium aresenide, silicon, chrome) and is non-corrosive to various metal and oxide surfaces under proper usage.

PRR-001 Remover does not contain phosphates, chromates, phenol, chlorinated hydrocarbons, nor sulfonic acids, and no special handling precautions are necessary. PRR-001 works well at room temperature with a bath life of approximately 2000 wafers/gallon. At elevated temperatures removal of polyamide can be achieved. The cost per wafer is less than one penny. The shelf-life of PRR-001 is one year when stored in a cool area away from direct sunlight.

CHEMICAL AND PHYSICAL PROPERTIES:

Appearance Light yellow liquid
Specific Gravity (@68°F) 0.99 +/- 0.01
Refractive Index (nD 26.0°C) 1.4271 +/- 0.0005
pH (@ 68°F) 12.60 +/- 0.05

APPLICATION:

Bath Make-Up:

Full strength for all semiconductor operations, by a spray or immersion process.

Bath Operations:

For immersion work, 3 to 5 minutes at room temperature with agitation. Solution can be at elevated temperatures (70-90°C). Use of two tank systems for immersion removal or conveyorized equipment for spray removal.

Rinse:

PRR-001 is completely miscible with water: only D.I. water rinse is necessary.

Bath Life:

Bath replacement should take place when removal time exceeds 15 minutes or when quantity stripped exceeds 2000 wafers/gallon.

PRR-002

DESCRIPTION:

Positive Resist Remover PRR-002 is composed of a proprietary mixture of water miscible and biodegradable ingredients. It is specially formulated to remove (dissolve) all common positive working photoresists treated with deep UV for ion implant, ion milling or plasma etch systems on various metal substrates. PRR-002 is non-corrosive to various metal and oxide surfaces under proper usage.
PRR-002 Remover does not contain phosphates, chromates, phenol, chlorinated hydrocarbons, nor sulfonic acids, and no special handling precautions are necessary. PRR-002 is compatible with all teflon, polypropylene and polyethylene materials. PRR-002 works well at room temperature or at slightly elevated temperatures for difficult stripping situations. Use of PRR-002 will result in noticeable cost saving per wafer. PRR-002 should be stored in a cool area away from direct sunlight. The recommended shelf-life is six months.

CHEMICAL AND PHYSICAL PROPERTIES:

Appearance Light yellow liquid
Specific Gravity (@68°F) 0.97 +/- 0.01
Refractive Index (nD 22.5°C) 1.4271 +/- 0.0005
pH (@ 68°F) Above 12.0
Filtration 0.2µ
Appearance Light yellow liquid
Specific Gravity (@68°F) 0.99 +/- 0.01
Refractive Index (nD 26.0°C) 1.4271 +/- 0.0005
pH (@ 68°F) 12.60 +/- 0.05

APPLICATION:

Bath Make-Up: Full strength for most semiconductor operations.

Bath Operations:

A two-tank system is recommended.

  1. For standard resist processing (90°- 140°C): 55°C for 3-5 minutes.
  2. For deep UV and hardened resist processing (150°- 200°C): 55° to 90° for 5-10 minutes per tank.

Rinse: PRR-002 is completely miscible with water; only D.I. water rinse (5 min.) is necessary.

Bath Replenishment / Replacement:

Bath replacement should take place when removal time exceeds 15 minutes or when quantity stripped exceeds 2000 wafers/gallon.

  1. Replenishment should be made to maintain capacity levels as needed.
  2. Bath replacement should be done when removal time exceeds 20 minutes per tank.

PRR 5-4

Positive Resist Remover PRR 5-4 is composed of a proprietary mixture of water miscible inorganic and organic alkaline ingredients. It is specially formulated to remove (dissolve) common positive working photoresists treated with deep UV for ion implant, ion milling or plasma etch systems on various metal substrates. PRR 5-4 Remover does not contain phosphates, chromates, phenol, or chlorinated hydrocarbons, and no special handling precautions are necessary. PRR 5-4 is compatible with all teflon, polypropylene and polyethylene materials. PRR 5-4 works well at room temperature or at slightly elevated temperatures for difficult stripping situations. Use of PRR 5-4 will result in noticeable cost saving per wafer. PRR 5-4 should be stored in a cool area away from direct sunlight. The recommended shelf life is one year.

PRR-592 is a dilute TMAH solution with normality 0.660-0.720, suitable for spray applications in wafer, photomask, and flat panel display processing.

PROPERTIES

Property PRR 5-4 PRR-592
Appearance Clear liquid Clear liquid
Specific gravity (@68 oF) 1.04 +/- 0.02 1.01
Refractive index (nD 26.0 oC) 1.4437 +/- 0.0005 ——-
pH (@ 68°F) Above 10.0 Above 10.0
Filtration 0.1μ 0.1μ
Strip Temperature 20°C 20-50°C
Removal Rate 0.15 microns/minute 0.2-0.4 microns/minute

APPLICATION:

Bath Make-Up:
Full strength for most semiconductor operations.

Bath Operations:
1. For standard resist processing (90o- 100oC): 20 oC for 3-5 minutes.
2. For deep UV and hardened resist processing (100o- 150oC): 55o to 90o C for 5-10 minutes.

Rinse:
PRR 5-4 is completely miscible with water; only rinse in deionized water.

Bath Replenishment / Replacement:
1. Replenishment should be made to maintain capacity levels as needed.
2. Bath replacement should take place when removal time exceeds 20 minutes per tank.

RESIST STRIP 586

Resist Strip 586 is an organic, non-flammable, NMP-free stripper for positive photoresists. Useful in the manufacture of MEMS devices, photomasks, LED, integrated circuit technology, Resist Strip 586 offers additional compatibility with GaAs and other III-V substrates. The water miscible strip contains a non-ionic surfactant for improved wettability without ionic contamination.

PROPERTIES

Operating Temperature 75-125°C
Processing Time 10-30 minutes with agitation
Specific gravity 1.2 g/cc
Viscosity 10 cps at 20°C
pH Above 10
Rinse 5 minutes with hot water and agitation
Post-Rinse (optional) iso-propyl alcohol
Shelf Life 1 year

APPLICATION

Resist Strip 586 is normally used at a working temperature between 75 and 125 oC. Processing time is application specific but normally requires at least ten minutes of exposure for complete removal. Stripping is followed by a rinse in hot deionized water and, optionally, iso-propyl alcohol.