Bright Electroless Tin

Simple immersion technique for bright electroless tin plating process. Deposit pure tin onto copper, brass, other copper-based alloys, gold and lead-tin electroplate.

FEATURES:

  • Plates pure tin rapidly
  • Plating exhibits fine-grain tin structure
  • Affords unusual resistance to humidity and salt-spray
  • Excellent solderability
  • Process simple to operate and maintain

BRIGHT ELECTROLESS TIN
DESCRIPTION:

Bright Electroless Tin is a well-developed formulation based upon the reduction characteristics of chelated tin in the divalent state. Under proper conditions reduction to pure tin occurs readily. A grain-refining agent, free of phosphorus, is present as well as an activator and buffers for pH control.

The deposited tin, in addition to good chemical resistance, exhibits excellent adhesion and is very solderable even after exposure to extreme humidity testing. Bright Electroless Tin is therefore used to provide corrosion protection to copper and lead-tin electroplate. A minimum of 25 millionths of an inch of tin deposit is required.

Bright Electroless Tin is recommended to preserve solderability of printed circuit boards, either copper or lead-tin electroplate. It is also used for plating electronic parts such as diodes or leads and for the corrosion protection of die stampings and machined copper or brass parts.

PLATING FORMULA
To prepare the electroless tin plating solution use 5 lbs. Part A with one-half gallon Part B, and add 3 gallons water. Stir. All material will dissolve when plating solution is operated at 180 °F.”

PLATING RATE (on copper)

Time in minutes Thickness in Microinches
( @ 180 °F) ( 10-6 inches)
5 40
10 65
15 80
30 100

PLATING YIELD

Bright Electroless Tin will deposit 25 millionths of an inch over 100 sq. ft. of copper/gallon of plating solution.

Available in

Part A – (Powder)
1 lb. container 1/2 gal container
5 lb. container 1 gal container
50 lb. container 5 gal container

Part B – (Liquid)
1/2 gal container
1 gal container
5 gal container