TANTALUM ETCHANTS SIE-8607 and 111

DESCRIPTION:

Transene Tantalum Etchants SIE-8607 and 111 are high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications. Tantalum Etchant SIE-8607 is a more aggressive etchant for faster etch rates. Tantalum Etchant 111 is a slower etching solution for optimum control and is more effective for removing tantalum oxide layers. Both etchants are filtered to remove all particulates above 0.2 microns.

PROPERTIES OF TRANSENE TANTALUM ETCHANT SIE-8607

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH Strongly acidic
Etch Rate at 25°C 70-80 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Au

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Oxide, nitride, Al, Si
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information

PROPERTIES OF TRANSENE TANTALUM ETCHANT 111

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH Strongly acidic
Etch Rate at 25°C 30-40 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials See http://transene.com/etch-compatibility/ for more details.
Select Incompatible Materials Oxide, nitride, Al, GaAs
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information

APPLICATION:

Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity. Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation. Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.