TITANIUM ETCHANTS

Selective and controllable etchants for application in semiconductor fabrication and thin film microelectronics technology.

Titanium Etchant TFT

Designed for etching evaporated films commonly employed as bonding and barrier layers in microelectronics. Excellent resolution, photo resist compatibility, and minimal undercutting are readily achieved.

Titanium Etchant TFTN

Intended for etching Ti films deposited on glass or SiO2 substrates. TFTN does not contain hydrofluoric acid.

PROPERTIES OF TRANSENE TITANIUM ETCHANT TFT

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH Strongly acidic
Etch Rate at 20°C 25 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Au, Cu, Ni, Cr

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Glass, oxide, nitride, GaAs
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information Contains HF!

PROPERTIES OF TRANSENE TITANIUM ETCHANT TFTN

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH Strongly acidic
Etch Rate at 70°C
85°C
10 Å/sec.
50 Å/sec.
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Au, SiO2, nitride

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Cu, Al
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information

OPERATION:

TFT TFTN
Tank Polyethylene Polyethylene or Quartz
Temperature 20°-50°C 70°-85°C
Etch Rate 25Å/sec @ 20°C
50Å/sec @ 30°C
10Å/sec @ 70°C
50Å/sec @ 85°C
Etch Rate, Thermal Oxide 7Å/sec @ 20°C
Rinse Water Water Water
* Compatible Resists Pos & Neg. Pos & Neg.
Metallization Most Metals Except Al

* KPR/KMER/KTFR: PKP (Transene); AZ/RISTON/ETC.