Advanced Materials for Electronics

Zincate
Immersion Zinc
Plating Solution

Zincate Electroless Immersion Zinc Plating Solution

DESCRIPTION:

Aluminum surfaces are not receptive to most plating processes due to their tendency to form oxides rapidly. Oxide formation inhibits uniform plating, resulting in inhomogeneous deposits, poor adhesion, or no deposition at all. By first applying Zincate Electroless Immersion Zinc Plating Solution to a properly prepared aluminum surface, it is possible subsequently deposit high quality electroless nickel films.

APPLICATION:

Plating onto aluminum involves a multiple step process.

  1. Non-etch clean the aluminum surface for up to 5 minutes with a detergent-based cleaner such as Transene Ultrasonic Detergent (TUD). Rinse thoroughly with cascading water.
  2. De-smut the surface for 10-30 seconds using an acid mixture. Transene RTM A for Plastics is a suitable agent for smut removal. Rinse again thoroughly.
  3. Mild etch for 5-10 seconds in a 25% solution of Transene Aluminum Etch Type A. Rinse again thoroughly.
  4. De-smut a second time and rinse as in step 2.
  5. Apply the first Zincate layer. Immerse the part in the Zincate solution for 1-2 minutes at room temperature until a gray color develops. Rinse.
  6. Remove the first Zincate layer using 50% nitric acid for 30-60 seconds or until the deposit turns white. Rinse.
  7. Apply a second Zincate layer for 30-60 seconds. Rinse thoroughly before applying electroless nickel to the surface.

Technical information and recommendations herein stated concerning application of these products are based on reliable laboratory tests and are believed to be accurate. No statements are to be construed as a license under existing patents. No warranty is expressed as to results obtained from these materials whether used singly or in combination with other materials.