General Purpose Epoxies
For Electronic Potting Applications
Newest epoxy materials for potting semiconductor components and electronic assemblies.
EPOXY – 125
Room temperature curing epoxy – for applications to 125 °C.
EPOXY – 175
Elevated temperature curing epoxy – for applications to 175 °C.
EPOXY – 200
Novalac-epoxy formulation – for applications to 200 °C.
Epoxy – 225
Resin-anhydride epoxy system – for high temperature applications to 225 °C.
GENERAL PURPOSE EPOXIES
General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xylene polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy. Resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.
General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.
PROPERTIES OF GENERAL PURPOSE EPOXIES
|Physical Properties||Epoxy –125||Epoxy –175||Epoxy –200||Epoxy –225|
|Heat Dist.temp. (°C)||125||175||200||225|
|Visc. Mixed (cps)||2,200||38,000||20,000||4,200|
|Flex. Str. (psi)||13,600||15,600||14,500||14,000|
|Comp.Yield Str. (psi)||15,000||15,820||35,000||18,500|
|Comp.Mod x 10-5(psi)||3.40||3.10||2.60||2.89|
|Tensile Str. (psi)||11,300||10,500||10,000||10,000|
|Tens.Mod x 10-5(psi)||¾||¾||4.3||4.4|
|Izod Imp. Str.(ft.lbs./in.notch)||0.3||0.33||0.50||0.48|
|Hardness, Shore D||85||90||90||90|
|Thermal Expan.(in/in/°C)x 10-6||30||30||30||30|
|Frequency, cps 60||4.10||4.18||3.93||3.09|
|Frequency, cps 103||3.99||4.12||3.88||3.07|
|Frequency, cps 106||3.39||3.57||3.47||2.91|
|Frequency, cps 60||0.0099||0.005||0.0067||0.0035|
|Frequency, cps 103||0.023||0.015||0.015||0.0054|
|Frequency, cps 106||0.034||0.039||0.029||0.015|
|Volume Resist.||1.19 x 1016||1.2 x 1016||1.2 x 1016||5.8 1016|
|Surface Resist.||7.9 x 1015||7.8 x 1015||7.9 x 1015||7.9 x 1015|
|Dielect. Str. V/mil||420||455||585||390|
|Arc Resit. (Av.Sec.)||¾||¾||120||75|
|Resin: Hardener Ratio||100:17||100:12||100:10||100:45|
|Pot Life||1 hr.||4 hrs.||4 hrs.||>24Hrs.|
|Initial Gel||4 hrs @ RT||2 hrs @ 90 °C.||2 hrs @ 80 °C.||2 hrs @ 90 °C.|
|Post-Cure||+48 hrs @ RT||+4 hrs @ 150 °C.||+2 hrs @ 150 °C.||+4 hrs @ 165 °C
Epoxy Based Potting Compound XS-531
Epoxy Based Potting Compound XS-531 is a high quality product formulated for potting electronic assemblies. It is designed for military applications and complies with military specifications, (XS-531 Department of Navy, Bureau of Naval Weapons).
|Viscosity (mixed)||2,000 pcs (approx.)|
|Hardness||70-90 (shore D)|
|Insulation Resistance, as cast||106 megohms (min)|
|Insulation Res., after humidity||103 megohms (min)|
|Bond Strength||1000 (min) psi|
75 Part A to 25 Part B. Deaeration recommended.
65 °-95 °C, 3-4 hours minimum
Thermally Conductive Epoxy Compounds
High thermal conductive epoxy compounds for potting semiconductor compounds for semiconductor components and electronic assemblies.
Epotherm – 130
Room temperature curing epoxy with high thermal conductivity and excellent electrical insulation properties – for applications up to 130 °C.
Epotherm – 180
Elevated temperature curing epoxy with high thermal conductivity and excellent electrical insulation – for applications up to 180 °C.
Epotherm epoxies, thermally conductive compounds, are specially formulated for the encapsulation and potting of electronic components and assemblies used at high temperatures. These potting compounds are highly filled systems containing aluminum oxide in laminar crystallographic form to achieve high thermal conductivity. Temperature-stable epoxy resins designed for these applications are also used in the formulation. Due to the excellent heat transfer characteristics of Epotherm, the dissipation of heat generated by the potted electronic components is assured.
Epotherm epoxies are supplied as two component systems, curable at room and elevated temperatures. In addition to high thermal conductivity, there is good adhesion, extremely low coefficient of expansion, and low shrinkage upon curing. High electrical insulation is not sacrificed.
Epotherm products should be used for low cost packaging of semiconductors, electronic components and assemblies when thermal considerations dictate the selection of potting materials with good heat transfer properties.
Properties of Epotherm Epoxy Compounds
Physical Properties Epotherm-130 Epotherm – 180
|Thermal Cond. Coef. BTU-ft/ft2-hr-°F||12||12|
|Coef. Of Therm. Expans. In/in/°C||20×10-6||18×10-6|
|Heat Distortion Temp °C||130||180|
|Viscosity (mixed) (cps)||40M||100M|
|Flexural Strength (psi)||13,000||13,500|
|Flexural Modulus (psi)||2×10-6||2×10-6|
|Compressive Yield Strength psi||14,200||14,500|
|Tensile Strength (psi)||9,000||8,500|
|Izod Impact Strength lb/in notch||0.30||0.25|
|Hardness – Shore D||95||95|
|Machinability||By grinding||By grinding|
|Dielect. Const. (av. 10-2 to 1010 cps)||4.0||4.5|
|Frequency 60 cps||0.01||0.008|
|Frequency 105 cps||0.02||0.01|
|Dielect. Strength volts/mil||420||450|
|Pot Life||1 hr.||6 hrs.|
|Cure||4 hrs. @ RT or mild heat||2 hrs. @ 70 °C.|
|Post-Cure||48 hrs @ RT||4 hrs @ 150 °C|