General Purpose Epoxies

For Electronic Potting Applications

Newest epoxy materials for potting semiconductor components and electronic assemblies.

EPOXY – 125
Room temperature curing epoxy – for applications to 125 °C.

EPOXY – 175
Elevated temperature curing epoxy – for applications to 175 °C.

EPOXY – 200
Novalac-epoxy formulation – for applications to 200 °C.

Epoxy – 225
Resin-anhydride epoxy system – for high temperature applications to 225 °C.

GENERAL PURPOSE EPOXIES
Description:

General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xylene polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy. Resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.

Applications
General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.

PROPERTIES OF GENERAL PURPOSE EPOXIES

Physical Properties Epoxy –125 Epoxy –175 Epoxy –200 Epoxy –225
Color Black Black Black Black
Heat Dist.temp. (°C) 125 175 200 225
Visc. Mixed (cps) 2,200 38,000 20,000 4,200
Flex. Str. (psi) 13,600 15,600 14,500 14,000
Flex.Mod.x 10-5(psi) 4.08 3.37 3.90 4.4
Comp.Yield Str. (psi) 15,000 15,820 35,000 18,500
Comp.Mod x 10-5(psi) 3.40 3.10 2.60 2.89
Tensile Str. (psi) 11,300 10,500 10,000 10,000
Tens.Mod x 10-5(psi) ¾ ¾ 4.3 4.4
Izod Imp. Str.(ft.lbs./in.notch) 0.3 0.33 0.50 0.48
Hardness, Shore D 85 90 90 90
Shrinkage (max.) 1% 1% 1% 1%
Thermal Expan.(in/in/°C)x 10-6 30 30 30 30
Electrical Properties
Dielectric Constant
Frequency, cps 60 4.10 4.18 3.93 3.09
Frequency, cps 103 3.99 4.12 3.88 3.07
Frequency, cps 106 3.39 3.57 3.47 2.91
Dissipation Factor
Frequency, cps 60 0.0099 0.005 0.0067 0.0035
Frequency, cps 103 0.023 0.015 0.015 0.0054
Frequency, cps 106 0.034 0.039 0.029 0.015
Volume Resist. 1.19 x 1016 1.2 x 1016 1.2 x 1016 5.8 1016
Surface Resist. 7.9 x 1015 7.8 x 1015 7.9 x 1015 7.9 x 1015
Dielect. Str. V/mil 420 455 585 390
Arc Resit. (Av.Sec.) ¾ ¾ 120 75
Cure Schedule
Resin: Hardener Ratio 100:17 100:12 100:10 100:45
Pot Life 1 hr. 4 hrs. 4 hrs. >24Hrs.
Initial Gel 4 hrs @ RT 2 hrs @ 90 °C. 2 hrs @ 80 °C. 2 hrs @ 90 °C.
Post-Cure +48 hrs @ RT +4 hrs @ 150 °C. +2 hrs @ 150 °C. +4 hrs @ 165 °C
+16hrs@ 200°C

Epoxy Based Potting Compound XS-531

Epoxy Based Potting Compound XS-531 is a high quality product formulated for potting electronic assemblies. It is designed for military applications and complies with military specifications, (XS-531 Department of Navy, Bureau of Naval Weapons).

PROPERTIES:

System 2-part
Filler Silica
Viscosity (mixed) 2,000 pcs (approx.)
Hardness 70-90 (shore D)
Insulation Resistance, as cast 106 megohms (min)
Insulation Res., after humidity 103 megohms (min)
Bond Strength 1000 (min) psi

MIXING RATIO:
75 Part A to 25 Part B. Deaeration recommended.

CURE:
65 °-95 °C, 3-4 hours minimum

Epotherm

Thermally Conductive Epoxy Compounds

High thermal conductive epoxy compounds for potting semiconductor compounds for semiconductor components and electronic assemblies.

Epotherm – 130
Room temperature curing epoxy with high thermal conductivity and excellent electrical insulation properties – for applications up to 130 °C.

Epotherm – 180
Elevated temperature curing epoxy with high thermal conductivity and excellent electrical insulation – for applications up to 180 °C.

EPOTHERM
DESCRIPTION

Epotherm epoxies, thermally conductive compounds, are specially formulated for the encapsulation and potting of electronic components and assemblies used at high temperatures. These potting compounds are highly filled systems containing aluminum oxide in laminar crystallographic form to achieve high thermal conductivity. Temperature-stable epoxy resins designed for these applications are also used in the formulation. Due to the excellent heat transfer characteristics of Epotherm, the dissipation of heat generated by the potted electronic components is assured.

Epotherm epoxies are supplied as two component systems, curable at room and elevated temperatures. In addition to high thermal conductivity, there is good adhesion, extremely low coefficient of expansion, and low shrinkage upon curing. High electrical insulation is not sacrificed.

APPLICATION:

Epotherm products should be used for low cost packaging of semiconductors, electronic components and assemblies when thermal considerations dictate the selection of potting materials with good heat transfer properties.

Properties of Epotherm Epoxy Compounds

Physical Properties Epotherm-130 Epotherm – 180

Color Black Black
Thermal Cond. Coef. BTU-ft/ft2-hr-°F 12 12
Coef. Of Therm. Expans. In/in/°C 20×10-6 18×10-6
Heat Distortion Temp °C 130 180
Viscosity (mixed) (cps) 40M 100M
Flexural Strength (psi) 13,000 13,500
Flexural Modulus (psi) 2×10-6 2×10-6
Compressive Yield Strength psi 14,200 14,500
Tensile Strength (psi) 9,000 8,500
Izod Impact Strength lb/in notch 0.30 0.25
Hardness – Shore D 95 95
Machinability By grinding By grinding
Electrical Properties
Dielect. Const. (av. 10-2 to 1010 cps) 4.0 4.5
Dissipation Factor
Frequency 60 cps 0.01 0.008
Frequency 105 cps 0.02 0.01
Volume Resistivity 8.9×1015 5×1016
Surface Resistivity 7.2×1015 8.5×1015
Dielect. Strength volts/mil 420 450
Arc.Resistance sec. 100
Cure Schedule
Resin: Hardener 100:5.5 100:4.5
Pot Life 1 hr. 6 hrs.
Cure 4 hrs. @ RT or mild heat 2 hrs. @ 70 °C.
Post-Cure 48 hrs @ RT 4 hrs @ 150 °C