Nickel Etchants

For Thin Film Circuits

Etchants for evaporated or electroplated nickel films. Good compatibility with positive and negative photoresists. Ideal for gold / nickel / nichrome or chromium resistor boards with alumina substrates.

NICKEL ETCHANT TFB
Standard nickel etchant for evaporated nickel films.

NICKEL ETCHANT TFG
High purity etchant for electrodeposited nickel films. Nickel Etchant TFG is compatible with copper, gallium arsenide, and other III -V compounds.

NICKEL ETCHANT TYPE I
High purity etchant for nickel, nickel-iron alloys, and stainless steel.

FEATURES

  • Economical
  • Compatible with positive and negative photoresists
  • Excellent fine line definition
  • Uniform etch rates

NICKEL ETCHANTS
DESCRIPTION:

Transene Thin Film Nickel Etchants (Nickel TFB and Nickel TFG) are high-purity nitrate-based formulations for superior etching of evaporated or electroplated nickel films. Nickel Etchants are compatible with both positive and negative photoresist materials. Recommended resists include AZ-111, AZ-1350 OH, and KMER. Nickel Etchants are commonly employed in the manufacture of resistor boards where films of gold, nickel, and nichrome or chromium are to be etched. Nickel Etchant TFG is compatible with copper.

PROPERTIES OF TRANSENE NICKEL ETCHANT TFB

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Water-white
pH Strong acid
Etch Rate at 30 oC  25 Å/second
Etch Capacity (rate declines at ~70%) 270 oz/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Au SiO2, Al2O3, Si3N4

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Ag
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information Suitable for evaporated or sputtered nickel

PROPERTIES OF TRANSENE NICKEL ETCHANT TFG

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Light yellow
pH Strong acid
Etch Rate at 40 oC 50 Å/second
Etch Capacity (rate declines at ~70%) 100 oz/gallon
Shelf Life 1 year
Storage Conditions Avoid freezing
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials GaAs, Au, Cu (most applications), glass, alumina, nitride

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Ag
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information Suitable for electroless or electrolytic nickel

APPLICATION:

Nickel Etchants are supplied ready-to-use as immersion type etchants. Etch rates may be controlled via operating temperature. Nickel is normally sandwiched between gold and nichrome or chromium on an alumina substrate. Either evaporative or electroless nickel may be employed. Actual etch is related to film thickness and operating temperature but is typically approximately one minute for evaporative nickel and about four minutes for electroless nickel. Etching should be followed with a deionized water rinse.

Nickel Etchant Type I

Nickel Etchant Type I is a high purity etchant for nickel, nickel-iron alloys, iron, iron oxide, and some types of stainless steel. Copper is also etched by Nickel Etchant Type I. Compatible with a wide range of photoresists (including KPR, Dynachem, AZ, Riston, and Screen Resists). Nickel Etchant Type I contains metal chelating ingredients for optimal performance. Nickel Etchant Type I will not attack gold films.

PROPERTIES OF TRANSENE NICKEL ETCHANT TYPE I

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Brown
pH Acidic
Etch Rate, Nickel Boron 3.2 mil/hr @ 40oC
Etch Rate, Nickel-Phosphorus 1.0 µ/hr @ 40oC
Etch Rate, Pure Nickel 4.8 mil/hr @ 40oC
Etch Rate, RTM Nickel 3.2 mil/hr @ 40oC
Etch Rate, Ni-Fe 400 Å/sec @ 50oC
Etch Rate, Stainless Steel 45 Å/sec @ 25oC AISI 316
105 Å/sec @ 30oC AISI 316

500 Å/sec @ 45oC AISI 304

Etch Rate, Fe2O3 50 Å/sec @ 50oC
Etch Rate, Cu 1 mil /min @ 40oC
Etch Capacity (rate declines at ~70%) 19 oz/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials Au, oxide, nitride, alumina

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Ni, Ti
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability Stock item
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases, nitric acid
Additional Information Immersion or spray application

APPLICATION:

Nickel Etchant Type I is used at elevated temperatures, typically 30-60°C. Continuous agitation is required for uniform, consistent results. A variety of metal, metal alloy, and metal oxide materials may be etched with Nickel Etchant Type I.