NICKEL VANADIUM ETCHANT NiV 28-23

DESCRIPTION:

Transene Thin Film Nickel Vanadium Etchant NiV 28-23 is a high-purity nitrate-based formulation for superior etching of evaporated nickel-vanadium alloy. NiV 28-23 is compatible with both positive and negative photoresist materials. Recommended resists include AZ-111, AZ-1350 OH, and KMER. NiV 28-23 etchant meets SEMI grade standards and is filtered to 0.2 micron.

PROPERTIES OF TRANSENE NICKEL VANADIUM ETCHANT NiV 28-23

How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Light yellow
pH Strong acid
Etch Rate at 25°C 25-35 Å/sec.
Etch Capacity (rate declines at ~70%) 100 g/gallon
Shelf Life 1 year
Storage Conditions Avoid freezing
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II
Select Compatible Materials GaAs, Au, Cu (most applications), glass, alumina, nitride

See http://transene.com/etch-compatibility/ for more details.

Select Incompatible Materials Al, Ag
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information Etches impure nickel such as NiV

APPLICATION:

Nickel Vanadium Etchant NiV 28-23 is supplied ready-to-use as an immersion type etchant. Etch rates may be controlled via operating temperature. Actual etch is related to film thickness, alloy makeup, density, and operating temperature but is typically approximately one minute for evaporative deposits. Etching should be followed with a deionized water rinse.