Silver Bond

Low Temperature Thermosetting Silver

Epoxy silver compositions for conductive bonding in microelectronic assembly applications

SILVER-BOND – TYPE 40
Standard low-temperature cure, high electrical conductivity

SILVER-BOND – Type 50
Fast low-temperature cure, high electrical conductivity

SILVER-BOND – TYPE 60
Long pot life, fast cure
Silver Bond 60 is listed on the NASA database for low outgassing materials
outgassing.nasa.gov

FEATURES

  • Low temperature curing systems
  • High bond strength
  • Electrical resistivity < 10-4ohm-cm
  • Low outgassing
  • Long pot life
  • Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz

SILVER-BOND
Conductive Adhesive
Description

Silver-Bond is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts. It provides high bond strength and excellent conductivity as well as low-temperature cure and long pot life. The product is designed for conductive bonding applications in microelectronics in place of lead tin solder or other alloys to avoid flux contamination or exposure to excessive temperature, and for process simplification. Silver-Bond Type 40 is especially recommended for bonding applications where it is desirable to keep process temperatures in the 100 °C range. Silver-Bond Type 50 is modified for faster curing applications. Silver-Bond Type 60 provides extended pot-life with fast cure at slightly elevated temperatures.

PROPERTIES OF SILVER-BOND

Type 40 Type 50 Type 60
Composition Silver Filled Epoxy same same
Consistency Soft Thixotropic paste same same
Viscosity 90,000 cps ± 10% same same
Elect. resitivity 1 x 10-4 ohm-cm max. same same
Lap shear strength 1500 psi nominal same same
Temperature stability range -65 °C to + 200 °C -65 °C to + 175 °C -65 °C to + 175 °C
Outgassing (postcure) <.01%/100 hr. @ 125 °C same same
Thermal conductivity 80 BTU-in/ft2hr°F same same
Pot life 6 hrs at 25 °C 2 hrs @ 25 °C 48 hrs @ 25 °C
Shelf life one year @ 25 °C same same
Mixing ratio A:B(by wt.) 100/3.6 100/2.5 100/2.5
Cure (at 100 °C) 2 hrs 10 minutes 10 minutes
Thinner Butyl Cellosolve Acetate same same
Mixing ratio (A : B) 100/3.6 100/2.5 100/2.5
Part A Part B Part B Part B
1 gram 0.036 gm (1 drop) 0.024 gm (1 drop) 1 drop
5 grams 0.180 gm (6 drops) 0.124 gm (4 drops) 4 drops
1 oz. (28.35gm) 1.023 gms (34 drops) 0.76gm (24 drops) 24 drops
Cure schedule
(Time: Temperature Relationship)
50 °C —- 30 minutes —-
75 °C 2 1/2 hrs. 15 minutes —-
100 °C 2 hrs. 10 minutes 10 minutes
125 °C 1 1/2 hrs. 5 minutes 5 minutes
150 °C 1 hr. —- 2 minutes