Ti-Tungsten TiW-30 is a selective etchant for titanium-tungsten adhesion layers in microelectronics applications. TiW-30 effectively etches Ti-tungsten films deposited on silicon nitride, or silicon oxide. TiW-30 provides excellent definition and etch rate control. Broad compatibility with positive and negative photoresists is offered.
Ti-Tungsten TiW-30 etchant is a ready-to-use solution specifically designed to remove titanium-tungsten alloy adhesion layers from substrates such as silicon dioxide and silicon nitride. TiW-30 will not attack aluminum films. Heating the etchant to 40°C will speed the etch rate for thicker films.
PROPERTIES OF TRANSENE Ti-TUNGSTEN TiW-30
|How do I increase the etch rate?||1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
|How do I reduce the etch rate?||Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.|
|Do I need to dilute the etchant?||No, it is ready to use.|
|How do I reduce undercutting?||Increase the rate of stirring or agitation.|
|Etch Rate at 40°C||10-15 Å/sec.|
|Etch Capacity (rate declines at ~70%)||65 g/gallon|
|Shelf Life||6 months|
|Storage Conditions||-40 to 0 oC|
|Recommended Operating Temperatures||20-80oC (30-40oC most common)|
|Photoresist Recommendations||KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP II|
|Select Compatible Materials||Au, glass, oxide, nitride, Ni, Cu
See http://transene.com/etch-compatibility/ for more details.
|Select Incompatible Materials||Ti|
|Compatible Plastics||HDPE, PP, Teflon, PFA, PVC|
|Country of Origin||USA|
|Available Sizes||Quart, Gallon, 5 Gallon, 55 Gallon|
|Incompatible Chemicals||Flammables, combustibles|
|Additional Information||Oxidizer. Store with vented cap.|