A silver plating solution for depositing thin uniform layers of bright silver by an electroless immersion process. The process operates by an electroless displacement of base metals by silver brought about by a difference in the EMF potentials. The product is designed to produce a bright silver plating on copper, brass and copper alloys with excellent adhesion. Plating occurs on other metals with varying degrees of adhesion.
|Operating Temperature||90 °C|
|Plating Time||5-10 minutes|
|Bath Life||To exhaustion of silver|
|Plating Capacity||8 grams silver metal per gal.
equivalent to 55 sq. ft. (1mg.sq.in.)