Advanced Materials for Electronics

Shape Products Copper Electroplating Chemicals

Shape Products specializes in custom copper plating chemistries tailored to your specific application requirements. Shape Products manufactures a range of high purity copper plating solutions including catholyte, anolyte, and electrolyte chemistries as well as additives and anodes. The copper plating solutions are used in copper damascene, dual damascene, pattern plating, and through-silicon via (TSV) applications. Class 100 cleanroom manufacturing conditions and liquid particle count analysis ensure low-particulate formulations, and our ICP-MS, potentiometric titration, TOC analysis, and cyclic voltammetry capabilities allow for production of high purity solutions suitable for the most demanding applications. A broad portfolio of electroless and electrolytic plating chemistries found at www.transene.com/electroplating-chemicals are also available through Shape Products.

Product Name
Analyte (CuSO4-A)
Analyte (CuSO4-A)
Anolyte Plating Solution
Anolyte Plating Solution
Anolyte VMS Solution, 50-pH2.0-50
Anolyte VMS Solution, 50-pH2.0-50
Anolyte VMS Solution, 63.5 – 1.8pH-80
Anolyte VMS Solution, 6807
Anolyte VMS Solution, 6932LA402.050
Anolyte VMS Solution, 6984LA63.52.080
Anolyte VMS Solution, 6984LA63.52.080
Anolyte VMS Solution, 6984LA63.52.080
Anolyte VMS Solution, 6984LA63.52.080
Catholyte (CuSO4-C)
Catholyte (CuSO4-C0
Catholyte Plating Solution, 6831
Catholyte Plating Solution, 6831
Catholyte Plating Solution, 6991
Copper Acid Plating Bath
Copper Anode Balls
Copper Electrolyte VMS Solution
Copper Electrolyte VMS Solution, 50-100-50
Copper Electrolyte VMS Solution, 50-100-50
Copper Interconnect Plating Solution, 6561MA403050
Copper Interconnect Plating Solution, 6561MA403050
Copper Interconnect Plating Solution, 6765
Copper Interconnect Plating Solution, 6765
Copper Interconnect Plating Solution, 6806
Copper Interconnect Plating Solution, 6884LA401050
Copper Makeup, 50-0-0
Copper Makeup, 50-21-84
Copper Plating Bath
Copper Plating Solution
Copper Plating Solution
Copper Plating Solution, 40-10-50
Copper Sulfate Liquid, 68 g/L as Copper
Copper Sulfate Solution, 6554
Copper Sulfate Solution, 6554
Copper Sulfate Solution, 6701
Copper Sulfate Solution, 68 g/L
Copper VMS Solution, 50-100-50
CopperMakeup, 40-10-50
TSV Anolyte Plating Solution
TSV Catholyte Plating Solution
TSV Catholyte Plating Solution
TSV Catholyte Plating Solution
TSV Catholyte Plating Solution
TSV Catholyte Plating Solution
TSV Catholyte Plating Solution
TSV Plating Solution, 63.5-50-80, 63.5-50-80
VMS 150 Solution, 200-100-75
VMS Solution