Shape Products Copper Electroplating Chemicals
Shape Products specializes in custom copper plating chemistries tailored to your specific application requirements. Shape Products manufactures a range of high purity copper plating solutions including catholyte, anolyte, and electrolyte chemistries as well as additives and anodes. The copper plating solutions are used in copper damascene, dual damascene, pattern plating, and through-silicon via (TSV) applications. Class 100 cleanroom manufacturing conditions and liquid particle count analysis ensure low-particulate formulations, and our ICP-MS, potentiometric titration, TOC analysis, and cyclic voltammetry capabilities allow for production of high purity solutions suitable for the most demanding applications. A broad portfolio of electroless and electrolytic plating chemistries found at www.transene.com/electroplating-chemicals are also available through Shape Products.
| Product Name |
| Analyte (CuSO4-A) |
| Analyte (CuSO4-A) |
| Anolyte Plating Solution |
| Anolyte Plating Solution |
| Anolyte VMS Solution, 50-pH2.0-50 |
| Anolyte VMS Solution, 50-pH2.0-50 |
| Anolyte VMS Solution, 63.5 – 1.8pH-80 |
| Anolyte VMS Solution, 6807 |
| Anolyte VMS Solution, 6932LA402.050 |
| Anolyte VMS Solution, 6984LA63.52.080 |
| Anolyte VMS Solution, 6984LA63.52.080 |
| Anolyte VMS Solution, 6984LA63.52.080 |
| Anolyte VMS Solution, 6984LA63.52.080 |
| Catholyte (CuSO4-C) |
| Catholyte (CuSO4-C0 |
| Catholyte Plating Solution, 6831 |
| Catholyte Plating Solution, 6831 |
| Catholyte Plating Solution, 6991 |
| Copper Acid Plating Bath |
| Copper Anode Balls |
| Copper Electrolyte VMS Solution |
| Copper Electrolyte VMS Solution, 50-100-50 |
| Copper Electrolyte VMS Solution, 50-100-50 |
| Copper Interconnect Plating Solution, 6561MA403050 |
| Copper Interconnect Plating Solution, 6561MA403050 |
| Copper Interconnect Plating Solution, 6765 |
| Copper Interconnect Plating Solution, 6765 |
| Copper Interconnect Plating Solution, 6806 |
| Copper Interconnect Plating Solution, 6884LA401050 |
| Copper Makeup, 50-0-0 |
| Copper Makeup, 50-21-84 |
| Copper Plating Bath |
| Copper Plating Solution |
| Copper Plating Solution |
| Copper Plating Solution, 40-10-50 |
| Copper Sulfate Liquid, 68 g/L as Copper |
| Copper Sulfate Solution, 6554 |
| Copper Sulfate Solution, 6554 |
| Copper Sulfate Solution, 6701 |
| Copper Sulfate Solution, 68 g/L |
| Copper VMS Solution, 50-100-50 |
| CopperMakeup, 40-10-50 |
| TSV Anolyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Catholyte Plating Solution |
| TSV Plating Solution, 63.5-50-80, 63.5-50-80 |
| VMS 150 Solution, 200-100-75 |
| VMS Solution |
