Copper Plating Acid Type
Transene Copper Plating Acid Type is ideal for high-speed copper deposition including through hole plating. The bath exhibits good stability and is easily controlled. Stabilizer limit resistivity and promote a bright deposit.
|Current Density (A/ft2)||20-50|
|Anode to cathode ratio||1:1|
|Tank||Glass, fiberglass, pvc, ceramic, rubber|
|pH||2.5 – 3.5|
|pH control||Sulfuric Acid|
|Deposition rate @ 20 asf||0.5 mil/hour|
|Copper concentration (oz/gal)||6|
|Recommended Additive Concentration||30 g/L of solution|
Copper Plating Acid Type is used to plate copper of any thickness onto ferrous base metals over copper strike. Especially suited for plating through holes and over trenches where over plating is a concern. The bright deposit consists of uniformly distributed rather than columnar grains. Copper Plating Acid Type is also advantageous as a protective coating under nichrome. Leveler, Activator, and Surfactant additives are available.