For Electronic Potting Applications
Newest epoxy materials for potting semiconductor components and electronic assemblies.
EPOXY – 125
Room temperature curing epoxy – for applications to 125°C.
EPOXY – 175
Elevated temperature curing epoxy – for applications to 175°C.
EPOXY – 200
Novalac-epoxy formulation – for applications to 200°C.
Epoxy – 225
Resin-Anhydride epoxy system – for high temperature applications to 225°C.
General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xyline polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.
General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.
PROPERTIES OF GENERAL PURPOSE EPOXIES
|Physical Properties||Epoxy –125||Epoxy –175||Epoxy –200||Epoxy –225|
|Heat Dist.temp. (oC)||125||175||200||225|
|Visc. Mixed (cps)||2,200||38,000||20,000||4,200|
|Flex. Str. (psi)||13,600||15,600||14,500||14,000|
|Comp.Yield Str. (psi)||15,000||15,820||35,000||18,500|
|Comp.Mod x 10-5(psi)||3.40||3.10||2.60||2.89|
|Tensile Str. (psi)||11,300||10,500||10,000||10,000|
|Tens.Mod x 10-5(psi)||¾||¾||4.3||4.4|
|Izod Imp. Str.(ft.lbs./in.notch)||0.3||0.33||0.50||0.48|
|Hardness, Shore D||85||90||90||90|
|Thermal Expan.(in/in/oC)x 10-6||30||30||30||30|
|Frequency, cps 60||4.10||4.18||3.93||3.09|
|Frequency, cps 103||3.99||4.12||3.88||3.07|
|Frequency, cps 106||3.39||3.57||3.47||2.91|
|Frequency, cps 60||0.0099||0.005||0.0067||0.0035|
|Frequency, cps 103||0.023||0.015||0.015||0.0054|
|Frequency, cps 106||0.034||0.039||0.029||0.015|
|Volume Resist.||1.19 x 1016||1.2 x 1016||1.2 x 1016||5.8 1016|
|Surface Resist.||7.9 x 1015||7.8 x 1015||7.9 x 1015||7.9 x 1015|
|Dielect. Str. V/mil||420||455||585||390|
|Arc Resit. (Av.Sec.)||¾||¾||120||75|
|Pot Life||1 hr.||4 hrs.||4 hrs.||>24Hrs.|
|Initial Gel||4 hrs @ RT||2 hrs @ 90oC.||2 hrs @ 80oC.||2 hrs @ 90oC.|
|Post-Cure||+48 hrs @ RT||+4 hrs @ 150oC.||+2 hrs @ 150oC.||+4 hrs @ 165oC