Semiconductor Junction Coating
Silicone Elastomer Systems for Protection and Passivation of Semiconductor Junctions
Translastic Semiconductor Junction Coatings, Types 3811 and 3812, are high purity, 100% solids, siloxane systems designed for passivation coating transistor, diode and rectifier junctions. Demanding production procedures and rigid quality control requirements guarantee ionic purity levels of 1 ppm (maximum). Typical applications include conformal coatings to provide mechanical and electrical insulation prior to plastic molding; protective coatings over hybrid integrated circuits to prevent chip damage during potting; and other ultra-pure, hermetic-type passivations.
Type 3811 and 3812 Junction Coatings will prevent electrical breakdown, minimize junction surface leakage, stabilize peak inverse voltage, and provide environmental protection for high temperature performance and thermal cycling.
PROPERTIES | TYPE 3811 | TYPE 3812 |
System | One-Part | Two-part |
Solids | 100% | 100% |
Appearance | Clear | Clear |
Viscosity | 7,500 cps | 5,000 cps |
Shelf Life | 3 months | 12 months |
Storage Temperature | 40 °F or below | Room Temperature |
Specific Gravity | 1.03 | 1.03 |
Mix Ratio | —— | 10 to 1 |
Pot Life | —— | > 48 hours |
Durometer (shore A) | 30 | 30 |
Tensile Strength (psi) | 400 | 350 |
Elongation (%) | 130 | 140 |
Dielectric Strength (V/mil) | > 450 | > 450 |
Dielectric Constant @ 106 Hz | 3.50 | 3.50 |
Volume Resistivity ohm/cm | 1015 | 1015 |
Dissipation Factor @ Imc | 0.001 | 0.001 |
METALLIC IMPURITY (by spectographic analysis)
Metal | ppm Max. | Metal | ppm Max. |
Aluminum (Al) | 1.0 | Lead (Pb) | 1.0 |
Antimony (Sb) | 1.0 | Magnesium (Mg) | 1.0 |
Chromium (Cr) | 1.0 | Nickel (Ni) | 1.0 |
Copper (Cu) | 1.0 | Potassium (K) | 1.0 |
Iron (Fe) | 1.0 | Sodium (Na) | 1.0 |
CURE:
Electrical performance of junctions coated with these elastomers is influenced by both temperature and duration of cure. Longer post-cures and higher temperatures generally improve device characteristics.
CURE SCHEDULE:
1/2 hour @ 80 °C + (optional)
1 hour @ 135 °- 150 °C (cure)
2 hours @ 200 °-225 °C (post cure-minimum)
Semiconductor Junction Coating – Type I
Low cost, heat stable, moisture resistant, high purity silicone resin for semiconductor applications. Designed specifically for environmental protection of transistors, diodes and rectifiers.
PHYSICAL PROPERTIES:
System | One-part; rigid |
Base | Silicone resins |
Appearance | Light amber |
Specific Gravity | 1.03 |
Viscosity | 350 cps |
Flash Point | 90°F |
Thinner | Xylene |
Solids | 50% |
Shelf Life | 5 months @ 25°C |
Thermal Life 250°C | > 10,000 hours |
CHEMICAL SPECIFICATIONS:
Sodium | < 1 ppm |
Potassium | < 1 ppm |
ELECTRICAL:
Dielectric Strength | > 2500 (v/mil) |
Dielectric Constant | 2.75 (1 mc) |
Volume Resistivity | > 1016 ohm-cm |
Dissipation Factor | 0.001 (1 mc) |
APPLICATION:
Dip, paint, spray or transfer.
CURE:
Air dry for 20 minutes. Bake at 65°C for 20 minutes, then at 125° for 1/2 hour. Postcure at 225°C for 1/2 hour, or at 200°C for 5 hours.