Moly Etchant – TFM
Tungsten Etchant – TFW
Selective etchants for moly and tungsten thin-film metallizations used in semiconductor and microelectronics technology. TFM and TFW are safe, selective etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns, with minimal undercutting and negative photoresist compatibility. Controlled uniform etching is achieved by immersion or spray etch technique. Alternatively, Moly Etchant 679 is a positive-resist-compatible blend of phosphoric-acetic-nitric acid with slower etch properties.
PROPERTIES OF TRANSENE MOLY ETCHANT TFM
| How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
| Do I need to dilute the etchant? | No, it is ready to use. |
| How do I reduce undercutting? | Increase the rate of stirring or agitation. |
| Appearance | Brown |
| pH | 10 |
| Etch Rate at 30°C 80°C |
55 Å/sec. 85 Å/sec |
| Etch Capacity (rate declines at ~70%) | 30 g/gallon |
| Shelf Life | 1 year |
| Storage Conditions | Ambient |
| Filtration | 1 um |
| Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | PKP-308PI or HARE SQ (SU-8 type) |
| Select Compatible Materials | Au, Ni, Cu, alumina
See https://transene.com/etch-compatibility/ for more details. |
| Select Incompatible Materials | Al, Si, Si-O |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Availability | 1-2 days |
| Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
| Packaging | HDPE |
| Packing | 4 gallons/case |
| Isotropy | Isotropic |
| Incompatible Chemicals | Strong acids |
| Additional Information | — |
PROPERTIES OF TRANSENE TUNGSTEN ETCHANT TFW
| How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
| Do I need to dilute the etchant? | No, it is ready to use. |
| How do I reduce undercutting? | Increase the rate of stirring or agitation. |
| Appearance | Brown |
| pH | 8 |
| Etch Rate at 20°C | 30 Å/second (immersion)
80 Å/second (spray) |
| Etch Capacity (rate declines at ~70%) | 64 g/gallon |
| Shelf Life | 1 year |
| Storage Conditions | Ambient |
| Filtration | 1 um |
| Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | PKP-308PI or HARE SQ (SU-8 type) |
| Select Compatible Materials | Au, Ni, Cu, alumina
See https://transene.com/etch-compatibility/ for more details. |
| Select Incompatible Materials | Al, Si, Si-O |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Availability | 1-2 days |
| Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
| Packaging | HDPE |
| Packing | 4 gallons/case |
| Isotropy | Isotropic |
| Incompatible Chemicals | Strong acids |
| Additional Information | — |
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