Advanced Materials for Electronics



Selective, controllable etchant for application in semiconductor fabrication and thin film microelectronics technology.

Niobium Etchant Nb-41 is designed for etching evaporated deposits. Excellent resolution, compatibility with both positive and negative photoresists, and minimal undercutting are readily achieved.  Because Nb-41 is based on a hydrofluoric acid -nitric acid formulation, oxides are incompatible.


Niobium Etchant Nb-41 is supplied ready to use.  Constant agitation during etching is required to achieve consistent, uniform results.  Etch rates may vary depending on the density of the deposit, temperature, and degree of agitation.  Glass containers must be avoided.  Gold is compatible with Nb-41.


How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Clear, colorless
pH Strong Acid
Etch Rate at 20°C 25-30 Å/sec
Etch Capacity (rate declines at ~70%) 65 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 0.2 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQT (SU-8 type), TRANSIST, or PKP-Type II
Select Compatible Materials Au, Cu, Cr

See for more details.

Select Incompatible Materials Glass, oxide, nitride, GaAs
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability 1-2 days
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases
Additional Information Contains HF!