Electroless Nickel Plating Strike
For Copper, Brass and Copper Alloys
An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloys.
PROPERTIES:
| Appearance | Green solution |
| Operating Temp. | 85 °C – 95 °C |
| pH | 3.2 optimum |
| Plating Rate | 20 x 10-6 in./min. |
| Deposition | Nickel 90%/Phosphorus 10% |
| Plating Capacity ( 50% depletion) |
6,750 sq. in. / 20 m in./gal. |
CLEANING PROCEDURE FOR COPPER SAMPLES:
- Clean copper with some physical abrasion.
- Dip for one minute in alkaline cleaner at 65 °C (150 °F).
- Rinse with deionized water.
- Dip for one minute in 30% HCl
- Rinse with deionized water.
PLATING BATH – USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (Electroless Nickel Plating). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
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Transene Company’s quality system is ISO 9001:2015 certified.
A copy of our quality policy is available upon request.
Click here for a copy of our ISO certificate