Palladium Etchants
PALLADIUM ETCHANT TFP
Palladium Etchant TFP is designed for high resolution pattern delineation of sputtered, evaporated and electrolessly deposited films. These films are commonly employed barrier layers for silicon wafer metalization systems of nickel and gold.
PROPERTIES OF TRANSENE PALLADIUM ETCHANT TFP
How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
Do I need to dilute the etchant? | No, it is ready to use. |
How do I reduce undercutting? | Increase the rate of stirring or agitation. |
Appearance | Brown |
pH | Acidic |
Etch Rate at 50°C | 110 Å/sec. |
Etch Capacity (rate declines at ~70%) | 100 g/gallon |
Shelf Life | 1 year |
Storage Conditions | Ambient |
Filtration | 1 um |
Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
Rinse | Deionized water |
Photoresist Recommendations | KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI |
Select Compatible Materials | Au, oxide, nitride, alumina
See https://transene.com/etch-compatibility/ for more details. |
Select Incompatible Materials | Al, Ni, Ti, Cu |
Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
Country of Origin | USA |
Availability | Stock item |
Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
Packaging | HDPE |
Packing | 4 gallons/case |
Isotropy | Isotropic |
Incompatible Chemicals | Strong bases, nitric acid |
Additional Information | Immersion or spray application |
PALLADIUM ETCHANT EC
Palladium Etchant EC is formulated for precise electrochemical etching of palladium substrates. Electrochemical etching allows for targeted etching of the substrate material.
OPERATION:
Appearance | Transparent Solution |
pH | < 1 |
Temperature | 25-30 °C |
Power | 10 V DC |
Cathode | Graphite |