Advanced Materials for Electronics

Palladium Etchants


Palladium Etchant TFP is designed for high resolution pattern delineation of sputtered, evaporated and electrolessly deposited films. These films are commonly employed barrier layers for silicon wafer metalization systems of nickel and gold.


How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Appearance Brown
pH Acidic
Etch Rate at 50°C 110 Å/sec.
Etch Capacity (rate declines at ~70%) 100 g/gallon
Shelf Life 1 year
Storage Conditions Ambient
Filtration 1 um
Recommended Operating Temperatures 20-80oC (30-40oC most common)
Rinse Deionized water
Photoresist Recommendations KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI
Select Compatible Materials Au, oxide, nitride, alumina

See for more details.

Select Incompatible Materials Al, Ni, Ti, Cu
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Country of Origin USA
Availability Stock item
Available Sizes Quart, Gallon, 5 Gallon, 55 Gallon
Packaging HDPE
Packing 4 gallons/case
Isotropy Isotropic
Incompatible Chemicals Strong bases, nitric acid
Additional Information Immersion or spray application


Palladium Etchant EC is formulated for precise electrochemical etching of palladium substrates. Electrochemical etching allows for targeted etching of the substrate material.


Appearance Transparent Solution
pH < 1
Temperature 25-30 °C
Power 10 V DC
Cathode Graphite