Silver Bond
Low Temperature Thermosetting Silver
Epoxy silver compositions for conductive bonding in microelectronic assembly applications
SILVER-BOND – TYPE 40
Standard low-temperature cure, high electrical conductivity
SILVER-BOND – Type 50
Fast low-temperature cure, high electrical conductivity
SILVER-BOND – TYPE 60
Long pot life, fast cure
Silver Bond 60 is listed on the NASA database for low outgassing materials
outgassing.nasa.gov
FEATURES
- Low temperature curing systems
- High bond strength
- Electrical resistivity < 10-4ohm-cm
- Low outgassing
- Long pot life
- Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz
SILVER-BOND
Conductive Adhesive
Description
Silver-Bond is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts. It provides high bond strength and excellent conductivity as well as low-temperature cure and long pot life. The product is designed for conductive bonding applications in microelectronics in place of lead tin solder or other alloys to avoid flux contamination or exposure to excessive temperature, and for process simplification. Silver-Bond Type 40 is especially recommended for bonding applications where it is desirable to keep process temperatures in the 100 °C range. Silver-Bond Type 50 is modified for faster curing applications. Silver-Bond Type 60 provides extended pot-life with fast cure at slightly elevated temperatures.
PROPERTIES OF SILVER-BOND
| Type 40 | Type 50 | Type 60 | |
| Composition | Silver Filled Epoxy | same | same |
| Consistency | Soft Thixotropic paste | same | same |
| Viscosity | 90,000 cps ± 10% | same | same |
| Elect. resitivity | 1 x 10-4 ohm-cm max. | same | same |
| Lap shear strength | 1500 psi nominal | same | same |
| Temperature stability range | -65 °C to + 200 °C | -65 °C to + 175 °C | -65 °C to + 175 °C |
| Outgassing (postcure) | <.01%/100 hr. @ 125 °C | same | same |
| Thermal conductivity | 80 BTU-in/ft2hr°F | same | same |
| Pot life | 6 hrs at 25 °C | 2 hrs @ 25 °C | 48 hrs @ 25 °C |
| Shelf life | one year @ 25 °C | same | same |
| Mixing ratio A:B(by wt.) | 100/3.6 | 100/2.5 | 100/2.5 |
| Cure (at 100 °C) | 2 hrs | 10 minutes | 10 minutes |
| Thinner | Butyl Cellosolve Acetate | same | same |
| Mixing ratio (A : B) | 100/3.6 | 100/2.5 | 100/2.5 |
| Part A | Part B | Part B | Part B |
| 1 gram | 0.036 gm (1 drop) | 0.024 gm (1 drop) | 1 drop |
| 5 grams | 0.180 gm (6 drops) | 0.124 gm (4 drops) | 4 drops |
| 1 oz. (28.35gm) | 1.023 gms (34 drops) | 0.76gm (24 drops) | 24 drops |
| Cure schedule (Time: Temperature Relationship) |
|||
| 50 °C | —- | 30 minutes | —- |
| 75 °C | 2 1/2 hrs. | 15 minutes | —- |
| 100 °C | 2 hrs. | 10 minutes | 10 minutes |
| 125 °C | 1 1/2 hrs. | 5 minutes | 5 minutes |
| 150 °C | 1 hr. | —- | 2 minutes |
Customer Tools
Locations
Transene Company’s quality system is ISO 9001:2015 certified.
A copy of our quality policy is available upon request.
Click here for a copy of our ISO certificate