Tin 100% Plating Solution
The tin plating solution consists of metal fluoborates, addition agents, stabilization additives and proprietary wetting agents in ready-to-use form. The solution affords a high degree of uniformity and fine grain structure with a minimum of operational control. Excellent solderability and wire plating.
OPERATING CONDITIONS –For all Plating Solutions
| Bath pH | < .5 |
| Temperature (°F) | 70-100 |
| Current Density (Amp./Sq.Ft.) | 25-30 |
| Voltage (volts) | 2-4 |
| Anodes (Polyprop. Bagged) | Same as metal plating compositions |
| Anode Efficiency (%) | 100 |
| Anode to Cathode Ratio | 2:1 |
| Agitation (Cathode-Rod) | Mild |
| Filtration: (Continuous or periodic) |
Rubber-lined steel filter presses or Other acid-resistant equipment. Filter Materials can be Terylene, nylon cloth filter paper or paper pulp. |
| Tin Concentration | 68 g/L |
PLATING CONTROL
- All materials which contact plating solution must be lined with PVC, Koroseal, rubber, Lucite, or polypropylene.
- Operating temperatures above 100 °F will increase % tin deposited.
- Cathode current density less than 25 asf will decrease % tin in alloy deposit. Conversely, current density greater than 30 asf will increase % tin in alloy deposit.
- Air agitation must not be used as it will oxidize tin. Adequate agitation may be provided by a moving work rod.
- A plating thickness of .001″ will be deposited in 17-20 minutes @ current density of 25-30 asf.
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Transene Company’s quality system is ISO 9001:2015 certified.
A copy of our quality policy is available upon request.
Click here for a copy of our ISO certificate