Advanced Materials for Electronics

Tin 100% Plating Solution

The tin plating solution consists of metal fluoborates, addition agents, stabilization additives and proprietary wetting agents in ready-to-use form. The solution affords a high degree of uniformity and fine grain structure with a minimum of operational control. Excellent solderability and wire plating.

OPERATING CONDITIONS –For all Plating Solutions

Bath pH < .5
Temperature (°F) 70-100
Current Density (Amp./Sq.Ft.) 25-30
Voltage (volts) 2-4
Anodes (Polyprop. Bagged) Same as metal plating compositions
Anode Efficiency (%) 100
Anode to Cathode Ratio 2:1
Agitation (Cathode-Rod) Mild
(Continuous or periodic)
Rubber-lined steel filter presses or Other acid-resistant equipment. Filter Materials can be Terylene, nylon cloth filter paper or paper pulp.
Tin Concentration 68 g/L


  1. All materials which contact plating solution must be lined with PVC, Koroseal, rubber, Lucite, or polypropylene.
  2. Operating temperatures above 100 °F will increase % tin deposited.
  3. Cathode current density less than 25 asf will decrease % tin in alloy deposit. Conversely, current density greater than 30 asf will increase % tin in alloy deposit.
  4. Air agitation must not be used as it will oxidize tin. Adequate agitation may be provided by a moving work rod.
  5. A plating thickness of .001″ will be deposited in 17-20 minutes @ current density of 25-30 asf.