TANTALUM ETCHANTS SIE-8607 and 111
DESCRIPTION:
Transene Tantalum Etchants SIE-8607 and 111 are high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications. Tantalum Etchant SIE-8607 is a more aggressive etchant for faster etch rates. Tantalum Etchant 111 is a slower etching solution for optimum control and is more effective for removing tantalum oxide layers. Both etchants are filtered to remove all particulates above 0.2 microns.
Literature Citation Referencing Application of Tantalum Etchant 111
PROPERTIES OF TRANSENE TANTALUM ETCHANT SIE-8607
How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
Do I need to dilute the etchant? | No, it is ready to use. |
How do I reduce undercutting? | Increase the rate of stirring or agitation. |
Appearance | Clear, colorless |
pH | Strongly acidic |
Etch Rate at 25°C | 70-80 Å/sec. |
Etch Capacity (rate declines at ~70%) | 65 g/gallon |
Shelf Life | 1 year |
Storage Conditions | Ambient |
Filtration | 0.2 um |
Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
Rinse | Deionized water |
Photoresist Recommendations | KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI |
Select Compatible Materials | Au
See https://transene.com/etch-compatibility/ for more details. |
Select Incompatible Materials | Oxide, nitride, Al, Si |
Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
Country of Origin | USA |
Availability | 1-2 days |
Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
Packaging | HDPE |
Packing | 4 gallons/case |
Isotropy | Isotropic |
Incompatible Chemicals | Strong bases |
Additional Information | — |
PROPERTIES OF TRANSENE TANTALUM ETCHANT 111
How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
Do I need to dilute the etchant? | No, it is ready to use. |
How do I reduce undercutting? | Increase the rate of stirring or agitation. |
Appearance | Clear, colorless |
pH | Strongly acidic |
Etch Rate at 25°C | 30-40 Å/sec. |
Etch Capacity (rate declines at ~70%) | 65 g/gallon |
Shelf Life | 1 year |
Storage Conditions | Ambient |
Filtration | 0.2 um |
Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
Rinse | Deionized water |
Photoresist Recommendations | KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI |
Select Compatible Materials | See https://transene.com/etch-compatibility/ for more details. |
Select Incompatible Materials | Oxide, nitride, Al, GaAs |
Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
Country of Origin | USA |
Availability | 1-2 days |
Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
Packaging | HDPE |
Packing | 4 gallons/case |
Isotropy | Isotropic |
Incompatible Chemicals | Strong bases |
Additional Information | — |
APPLICATION:
Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity. Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation. Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.