TITANIUM ETCHANTS
Selective and controllable etchants for application in semiconductor fabrication and thin film microelectronics technology.
Titanium Etchant TFT
Designed for etching evaporated films commonly employed as bonding and barrier layers in microelectronics. Excellent resolution, photo resist compatibility, and minimal undercutting are readily achieved.
Titanium Etchant TFTN
Intended for etching Ti films deposited on glass or SiO2 substrates. TFTN does not contain hydrofluoric acid.
PROPERTIES OF TRANSENE TITANIUM ETCHANT TFT
| How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
| Do I need to dilute the etchant? | No, it is ready to use. |
| How do I reduce undercutting? | Increase the rate of stirring or agitation. |
| Appearance | Clear, colorless |
| pH | Strongly acidic |
| Etch Rate at 20°C | 25 Å/sec. |
| Etch Capacity (rate declines at ~70%) | 65 g/gallon |
| Shelf Life | 1 year |
| Storage Conditions | Ambient |
| Filtration | 0.2 um |
| Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI |
| Select Compatible Materials | Au, Cu, Ni, Cr
See https://transene.com/etch-compatibility/ for more details. |
| Select Incompatible Materials | Glass, oxide, nitride, GaAs |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Availability | 1-2 days |
| Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
| Packaging | HDPE |
| Packing | 4 gallons/case |
| Isotropy | Isotropic |
| Incompatible Chemicals | Strong bases |
| Additional Information | Contains HF! |
PROPERTIES OF TRANSENE TITANIUM ETCHANT TFTN
| How do I increase the etch rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How do I reduce the etch rate? | Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%. |
| Do I need to dilute the etchant? | No, it is ready to use. |
| How do I reduce undercutting? | Increase the rate of stirring or agitation. |
| Appearance | Clear, colorless |
| pH | Strongly acidic |
| Etch Rate at 70°C 85°C |
10 Å/sec. 50 Å/sec. |
| Etch Capacity (rate declines at ~70%) | 65 g/gallon |
| Shelf Life | 1 year |
| Storage Conditions | Ambient |
| Filtration | 0.2 um |
| Recommended Operating Temperatures | 20-80oC (30-40oC most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI |
| Select Compatible Materials | Au, SiO2, nitride
See https://transene.com/etch-compatibility/ for more details. |
| Select Incompatible Materials | Cu, Al |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Availability | 1-2 days |
| Available Sizes | Quart, Gallon, 5 Gallon, 55 Gallon |
| Packaging | HDPE |
| Packing | 4 gallons/case |
| Isotropy | Isotropic |
| Incompatible Chemicals | Strong bases |
| Additional Information | — |
OPERATION:
| TFT | TFTN | |
| Tank | Polyethylene | Polyethylene or Quartz |
| Temperature | 20°-50°C | 70°-85°C |
| Etch Rate | 25Å/sec @ 20°C 50Å/sec @ 30°C |
10Å/sec @ 70°C 50Å/sec @ 85°C |
| Etch Rate, Thermal Oxide | 7Å/sec @ 20°C | |
| Rinse Water | Water | Water |
| * Compatible Resists | Pos & Neg. | Pos & Neg. |
| Metallization | Most Metals Except Al |
* KPR/KMER/KTFR: PKP (Transene); AZ/RISTON/ETC.
Customer Tools
Locations
Transene Company’s quality system is ISO 9001:2015 certified.
A copy of our quality policy is available upon request.
Click here for a copy of our ISO certificate