Shape Products Semiconductor and Microelectronics Materials
Shape Products manufactures a wide range of process chemicals for semiconductor and microelectronics applications. Example industries served include wafer processing, solar/photovoltaic, photomask, integrated circuit, mobile devices, automotive, aerospace, LED including phosphors, photronics, electronic components, TFT, LCD, mobile devices, and photolithography. Our chemicals are semi grade or better and are processed in our Class 10 and Class 100 cleanroom facilities equipped with ICP-MS, particle counter, TOC, HPLC, and other analytical equipment. A complete line of thin film metal etchants, conductive epoxy adhesives, and silicone encapsulants from Transene Company is available through Shape Products and may be found at www.transene.com.
Product Name |
Acetic Acid, Glacial, 99%, Tech |
Acetic Acid, Glacial, 99%, Tech |
Acetic Acid, Glacial, 99%, Tech |
Acetic Acid, Glacial, 99.7% min, ACS |
Acetic Acid, Glacial, 99.7% min, ACS |
Acetic Acid, Glacial, 99.7% min, Semi |
Acetone, 99%, Tech |
Acetone, 99%, Tech |
Acetone, 99%, Tech |
Acetone, 99%, Tech |
Acetone, 99.5% min, ACS |
Acetone, 99.5% min, ACS |
Acetone, 99.5% min, Semi |
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, ACS |
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, ACS |
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi |
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi |
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi |
Ammonium Persulfate, Crystal, ACS |
AP 10, Processor Cleaner |
Boric Acid Makeup Solution, 45g/L |
Boric Acid, Granular, Tech |
BTA Aqueous Solution |
CA-31, Cleaning Agent, with Surfactant |
CA-40, Mask Cleaner |
Cadmium Sulfate Solution, 0.35 M |
CC-200.60, Positive Resist Developer |
CC-200.75, Positive Resit Developer |
CES-333 Slurry |
Citric Acid Solution, 50% w/v |
Citric Acid Solution, 50% w/v |
Clean-100 |
CO Makeup Solution |
Cobalt Sulfate, Heptahydrate, Reagent |
Cobalt Sulfate, Heptahydrate, Reagent |
Dimethyl Sulfoxide, 99.9%, Electronic |
EBR Solvent Mixture |
EBR SR7 |
ECP Clean |
EDTA Disodium Salt, Dihydate Reagent, ACS |
Ethylene Glycol, 99.0% min, Electronic |
Ethylene Glycol, 99.0% min, Electronic |
Ethylene Glycol, 99.0% min, Reagent |
Ethylene Glycol/Water Solution |
Etidronic Acid 60% Aqueous Solution |
FE-12CC11, Iron Oxide Mask Etchant |
FE-12CC11, Iron Oxide Mask Etchant |
Ferric Chloride Solution, 42° Be, Tech |
Ferric Chloride Solution, 42° Be, Tech |
Ferric Chloride Solution, 42° Be, Tech |
Ferric Chloride, Hexahydrate, ACS |
Ferric Chloride, Hexahydrate, ACS |
Ferrous Sulfate, Heptahydrate, ACS |
Hydrochloric Acid, 36.5%-38.0%, ACS |
Hydrochloric Acid, 36.5%-38.0%, ACS |
Hydrochloric Acid, 36.5%-38.0%, ACS |
Hydrochloric Acid, 36.5%-38.0%, Semi |
Hydrochloric Acid, 36.5%-38.0%, Semi |
Hydrochloric Acid, 36.5%-38.0%, Semi |
Hydrochloric Acid, 36.5%-38.0%, Semi |
Hydrochloric Acid, 36.5%-38.0%, Semi |
Hydrochloric Acid, 48.8%-49.2%, Semi |
Hydrochloric Acid, 48.8%-49.2%, Semi |
Hydrochloric Acid, 48.8%-49.2%, Semi |
Hydrochloric Acid, 48.8%-49.2%, Semi |
Hydrogen Peroxide Solution, 30.0%-32.0%, CR TB |
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi |
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi |
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi |
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi |
Isopropyl Alcohol, 9% IPA, 91% D.I. Water |
ITO-12, ITO Etch |
ITO-14S, ITO Etch, With Surfactant |
ITO-55S, ITO Etch, With Surfactant |
MC-181C, Mask Cleaner |
MC-181C, Mask Cleaner |
MC-181C, Mask Cleaner |
Micro-90 Concentrated Cleaning Solution |
N-Methyl-2-Pyrrolidone, 99.8% min, Semi |
N-Methyl-2-Pyrrolidone, 99.8% min, Semi |
N-Methyl-2-Pyrrolidone, 99.8% min, Semi |
N-Methyl-2-Pyrrolidone, 99.8% min, Semi |
N-Methyl-2-Pyrrolidone, 99.8% min, Tech |
NAOH-3.8F, Sodium Hydroxide 3.8% |
NAOH-30, Sodium Hydroxide 30% |
NAOH-6F, Sodium Hydroxide 6% |
NH4OH-29HP, Ammonium Hydroxide 29% |
Nickel Chloride Solution, 177.0 – 182.0 g/L |
Nickel Chloride Solution, 6583 |
Nickel Sulfate Solution, 600 g/L |
Nitric acid 67.0%, Semi |
Nitric acid 67.0%, Semi |
Nitric Acid Solution, 68.0%-70.0%, Semi |
Nitric Acid Solution, 68.0%-70.0%, Semi |
Particle Standard, Si3n4, 0.0000005% |
PEG 4600 |
Potassium Fluoride/Hydrofluoric Acid Mix |
Potassium Hydroxide Solution, 45.0%-47.0%, Semi |
Potassium Hydroxide Solution, 45.0%-47.0%, Semi |
RA-2, Rinse Aid |
RS-2, Positive Resist Stripper |
RS-2, Positive Resist Stripper |
RS-6, Positive Resist Stripper |
Semi Sperse SS12 |