Advanced Materials for Electronics

Shape Products Semiconductor and Microelectronics Materials

Shape Products manufactures a wide range of process chemicals for semiconductor and microelectronics applications. Example industries served include wafer processing, solar/photovoltaic, photomask, integrated circuit, mobile devices, automotive, aerospace, LED including phosphors, photronics, electronic components, TFT, LCD, mobile devices, and photolithography. Our chemicals are semi grade or better and are processed in our Class 10 and Class 100 cleanroom facilities equipped with ICP-MS, particle counter, TOC, HPLC, and other analytical equipment. A complete line of thin film metal etchants, conductive epoxy adhesives, and silicone encapsulants from Transene Company is available through Shape Products and may be found at www.transene.com.

Product Name
Acetic Acid, Glacial, 99%, Tech
Acetic Acid, Glacial, 99%, Tech
Acetic Acid, Glacial, 99%, Tech
Acetic Acid, Glacial, 99.7% min, ACS
Acetic Acid, Glacial, 99.7% min, ACS
Acetic Acid, Glacial, 99.7% min, Semi
Acetone, 99%, Tech
Acetone, 99%, Tech
Acetone, 99%, Tech
Acetone, 99%, Tech
Acetone, 99.5% min, ACS
Acetone, 99.5% min, ACS
Acetone, 99.5% min, Semi
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, ACS
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, ACS
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi
Ammonium Hydroxide, 28.0 – 30.0%, as NH3, Semi
Ammonium Persulfate, Crystal, ACS
AP 10, Processor Cleaner
Boric Acid Makeup Solution, 45g/L
Boric Acid, Granular, Tech
BTA Aqueous Solution
CA-31, Cleaning Agent, with Surfactant
CA-40, Mask Cleaner
Cadmium Sulfate Solution, 0.35 M
CC-200.60, Positive Resist Developer
CC-200.75, Positive Resit Developer
CES-333 Slurry
Citric Acid Solution, 50% w/v
Citric Acid Solution, 50% w/v
Clean-100
CO Makeup Solution
Cobalt Sulfate, Heptahydrate, Reagent
Cobalt Sulfate, Heptahydrate, Reagent
Dimethyl Sulfoxide, 99.9%, Electronic
EBR Solvent Mixture
EBR SR7
ECP Clean
EDTA Disodium Salt, Dihydate Reagent, ACS
Ethylene Glycol, 99.0% min, Electronic
Ethylene Glycol, 99.0% min, Electronic
Ethylene Glycol, 99.0% min, Reagent
Ethylene Glycol/Water Solution
Etidronic Acid 60% Aqueous Solution
FE-12CC11, Iron Oxide Mask Etchant
FE-12CC11, Iron Oxide Mask Etchant
Ferric Chloride Solution, 42° Be, Tech
Ferric Chloride Solution, 42° Be, Tech
Ferric Chloride Solution, 42° Be, Tech
Ferric Chloride, Hexahydrate, ACS
Ferric Chloride, Hexahydrate, ACS
Ferrous Sulfate, Heptahydrate, ACS
Hydrochloric Acid, 36.5%-38.0%, ACS
Hydrochloric Acid, 36.5%-38.0%, ACS
Hydrochloric Acid, 36.5%-38.0%, ACS
Hydrochloric Acid, 36.5%-38.0%, Semi
Hydrochloric Acid, 36.5%-38.0%, Semi
Hydrochloric Acid, 36.5%-38.0%, Semi
Hydrochloric Acid, 36.5%-38.0%, Semi
Hydrochloric Acid, 36.5%-38.0%, Semi
Hydrochloric Acid, 48.8%-49.2%, Semi
Hydrochloric Acid, 48.8%-49.2%, Semi
Hydrochloric Acid, 48.8%-49.2%, Semi
Hydrochloric Acid, 48.8%-49.2%, Semi
Hydrogen Peroxide Solution, 30.0%-32.0%, CR TB
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi
Hydrogen Peroxide Solution, 30.0%-32.0%, Semi
Isopropyl Alcohol, 9% IPA, 91% D.I. Water
ITO-12, ITO Etch
ITO-14S, ITO Etch, With Surfactant
ITO-55S, ITO Etch, With Surfactant
MC-181C, Mask Cleaner
MC-181C, Mask Cleaner
MC-181C, Mask Cleaner
Micro-90 Concentrated Cleaning Solution
N-Methyl-2-Pyrrolidone, 99.8% min, Semi
N-Methyl-2-Pyrrolidone, 99.8% min, Semi
N-Methyl-2-Pyrrolidone, 99.8% min, Semi
N-Methyl-2-Pyrrolidone, 99.8% min, Semi
N-Methyl-2-Pyrrolidone, 99.8% min, Tech
NAOH-3.8F, Sodium Hydroxide 3.8%
NAOH-30, Sodium Hydroxide 30%
NAOH-6F, Sodium Hydroxide 6%
NH4OH-29HP, Ammonium Hydroxide 29%
Nickel Chloride Solution, 177.0 – 182.0 g/L
Nickel Chloride Solution, 6583
Nickel Sulfate Solution, 600 g/L
Nitric acid 67.0%, Semi
Nitric acid 67.0%, Semi
Nitric Acid Solution, 68.0%-70.0%, Semi
Nitric Acid Solution, 68.0%-70.0%, Semi
Particle Standard, Si3n4, 0.0000005%
PEG 4600
Potassium Fluoride/Hydrofluoric Acid Mix
Potassium Hydroxide Solution, 45.0%-47.0%, Semi
Potassium Hydroxide Solution, 45.0%-47.0%, Semi
RA-2, Rinse Aid
RS-2, Positive Resist Stripper
RS-2, Positive Resist Stripper
RS-6, Positive Resist Stripper
Semi Sperse SS12